The candidate must have a BS or MSEE degree and a minimum of 10 years of relevant working experience (15 yrs preferred) in physical design and CAD.
The candidate must have multiple successful tape-out experiences where the candidate is directly involved in various aspects of physical design; both as technical leads as well as project management functions.
A deep understanding of the physical design flow from RTL to GDS2 is required, as well as a general understanding of the various major vendor EDA tools and their strengths and weaknesses.
The candidate must also have a good understanding of the general silicon engineering process, from concept to tape-out to production.
Furthermore, large chip experience that requires hierarchical design methodology is a must.
The candidate should be a proven team leader, able to build, manage, and grow a diverse team. Must be experienced in managing complex, high performance physical designs in a schedule driven environment.
The candidate needs to be able to multitask well and be able to navigate complex requirements from multiple projects to set priorities for the team.
A successful candidate must have exceptional verbal, as well as written, communication skills, in both Mandarin and English.
In addition, the role requires outstanding people management skills to lead, motivate, and guide world class engineers.