CASPA 2009 BIMS Business Delegation
(Oct 25th-31th)
 
 
2009 CASPA BIMS Delegation Reports
Report prepared by Xiao Yan
 
Led by the president and chairman of CASPA, Jason Wang, and the head of the CASPA international delegation, Xianfeng Ding , CASPA 2009 BIMS delegation successfully participated 2009 Beijing International Microelectronics Symposium (BIMS), visited a few important organizations in Beijing and Tianjin.
 
Attached below, please review 2009 CASPA BIMS Delegation Reports
 [2009_CASPA_BIMS_Delegation_Reports.pdf].