Chairman's Words

Journey to the Next Quarter Century

More than a quarter century ago, a group of passionate Chinese American engineers and executives got together and decided to do something meaningful by bridging Silicon Valley to the rest of the world, promoting technology innovation, and helping career development. Twenty-seven years have passed, but the original mission has not changed.

During the years, CASPA has truly accomplished a lot. Helping world class semiconductor companies’ expansion to Asia is the highlight in CASPA’s achievements, as well as helping many Asia semiconductors companies become significant players in the world.

Through the years, various symposiums and workshops on forward-thinking technologies help benefit many companies, entrepreneurs, and engineers as well, including our most recent Symposiums on artificial Intelligence, ranked highly by Google search.

CASPA could not have had today’s success without our generous corporate sponsors.  CASPA’s free events for the community are made possible by the financial support from our corporate sponsors including ARM, Broadcom, Huawei, Intel, TSMC, and some 80+ more.

For over two decades, CASPA’s annual hi-tech job fair has helped match the talents with our corporates sponsors’ needs. 2018 marks the 23rd years of holding this signature events.

Individual members are the central part of an organization like CASPA. Being active volunteers or participating CASPA events, CASPA members are able to expand their network and circle of influence to help their career development. From attending CASPA events 20 years ago as a young engineer, then joining the board in 2011, to now becoming the President, I have learnt a great deal from our past Presidents and board members, and I continue to find CASPA the best place for me to serve the community and help those who needed it. I will always encourage you to join the community of 6800+ members, even particiate the volunteer board, and serve the community effectively, leveraging your background and experiences in the hi-tech industry.

As mobile computing, IoT and artificial intelligence drive current and next waves of growth, our ecosystem is ever more dynamic and global; Meanwhile, the ending of the Moore’s law and continuous consolidation and M&A has quickly evolved our industry. This is not the end but the beginning of a new era for our industry, and many challenges and opportunities lie ahead of us. CASPA’s past success has validated what we set out to do and given me the confidence that we have the solid foundation to get even better in serving our members, helping the community, and functioning as a platform to bridge the East and West, in this coming year, and many years after.


Brandon Wang, Chairman and President, CASPA